Intel Officially Announces Plan to Set Up 12-inch Wafer Plant in China
March 30, 2007
Intel and China government have signed a cooperation agreement on March 26, whereby Intel will build a 12-inch wafer chip plant in Dalian, China, to be named Fab 68. This new facility is expected to kick off construction in late 2007 and begin operations in 2010. The company also stated that it will also work to help China's government build a training center near the new facility with an investment of 348 million RMB (US$45.0 million; US$1 = 7.7 RMB), which will start operating in August 2008.